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100g and 10CC no clean lead free BGA tacky paste flux
![can packing of 100g](/u_file/product/15_06_30/350X350_4add4fdf61.jpg)
100g and 10CC no clean lead free BGA tacky paste flux
SHENZHEN BBIEN TECHNOLOGY LIMITED supplies100g per jar or 10CC per syringe no clean lead free BGA tacky paste flux;we have BGA flux,tacky paste flux,no clean paste flux,lead free tacky paste flux.It match with solder wire used together.
Good green strength
Fast curing
Six-month shelf life at 68°F (20°C) room temperature
Nine-month shelf life at 32°F (0°C)
Resists slumping and stringing with high (>6.0) thixotropic index
Meets IPC-SM-817 Requiements
BBIEN lead free tacky paste flux is formulated to meet the exacting performance and quality requirements of printed circuit board manufacturers. These versatile adhesives feature a unique combination of physical characteristics including:
Consistent, high dot profileGood green strength
Fast curing
Six-month shelf life at 68°F (20°C) room temperature
Nine-month shelf life at 32°F (0°C)
Resists slumping and stringing with high (>6.0) thixotropic index
Meets IPC-SM-817 Requiements
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Performance characterisitic:
Compatible with Lead Free alloys such as
· Reflow-able with peak temperatures up to 270 °C
· Reflow-able in air and nitrogen
· Bright shiny soldered joints with clear residues
· Aggressive flux on various substrates such as
OSP-Cu, Immersion finishes and ENIG
· Clear non-tacky residues
· High tack to minimize skewing of components
· Low voiding
· Stencil Life of 8+ hours (process dependent)
· Classified as ROL0 per J-STD-004
· Compliant to Bellcore GR-78
![](/u_file/images/15_06_30/a78c7a016f.jpg)
![](/u_file/images/15_06_30/d530cbdafe.jpg)
Cleaning:
TF LF-01 Tacky paste fluxis a no-clean chemistry. The residues do not need to be removed for typical applications. If
residue removal is required, call our Technical Support.
Compatible with Lead Free alloys such as
· Reflow-able with peak temperatures up to 270 °C
· Reflow-able in air and nitrogen
· Bright shiny soldered joints with clear residues
· Aggressive flux on various substrates such as
OSP-Cu, Immersion finishes and ENIG
· Clear non-tacky residues
· High tack to minimize skewing of components
· Low voiding
· Stencil Life of 8+ hours (process dependent)
· Classified as ROL0 per J-STD-004
· Compliant to Bellcore GR-78
![](/u_file/images/15_06_30/a78c7a016f.jpg)
![](/u_file/images/15_06_30/d530cbdafe.jpg)
Cleaning:
TF LF-01 Tacky paste fluxis a no-clean chemistry. The residues do not need to be removed for typical applications. If
residue removal is required, call our Technical Support.
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