Feature of Sn62Pb36Ag2 lead solder paste:

provides outstanding batch-to-batch consistency
· Excellent anti-slump characteristics minimizing bridging defects
· Capable of 60+ minute idle times in printing
· Capable of print speeds up to 150mm/sec (6in/sec)

· Excellent solderability to a wide variety of metallizations, including Palladium, leaving bright, shiny joints
· Residues easily removed with hot DI water, even up to 48 hours after soldering
· Minimal foam in wash systems

· 8+ hour stencil life
· Classified as ORM0 per J-STD-004
· Produces minimal voiding underneath BGA components
· Compatible with enclosed print head systems

Profile of Sn62Pb36Ag2 solder paste
62Pb36Ag2 lead solder is a type of no-clean solder paste that is air or nitrogen processabile, with good print definition and increased throughput. Its flux system is specially formulated to ensure better slump resistance during printing and preheating。

Sn62Pb36Ag2 has a melting point about 179°C to 183 degree, and has been successfully used with peak reflow profiles between 155°C and 190°C.Contained 2% silver,which make soldering point is brighter and very good soldering result.The outstanding 
some characteristics
batch consistency, anti-slump chemistry, consistent print volumes, solderability and cleanability make the Sn62Pb36Ag2 an ideal water-soluble solder paste for any application.
Sn62Pb36Ag2 solder paste is an organic acid, water-soluble solder paste that provides users with the highest level of consistency and performance.
Batch after batch, Sn62Pb36Ag2provides hours of stable stencil life, tack time and repeatable brick definition.

Sn62Pb36Ag2’srobust printing characteristics result in consistent solder paste volume regardless of idle time, stencil life and print speed. The activator package in the Sn62Pb36Ag2 is very aggressive and provides superior wetting to OSP-coated PCB’s
and Ag/Pd components.

Application:

SMT technology,PCB and led

Storage, Handling, and Shelf Life:
Refrigeration is the recommended optimum storage condition for solderpaste to maintain consistent viscosity,reflow characteristics and overall performance.  
It should be stabilized at room temperature prior to printing. Sn62Pb36Ag1 should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact BBIEN if you require additional advice with regard storage and handling of this material. Shelf life is 6 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).

Packing:
The Sn62Pb36Ag2 medium temperature lead solder paste could be classified as can/bottle packing and syringe packing type.
Each can/bottle holds the solder cream is 500g;
Each syringe can load the solder cream is 100g
The packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.
Carton size:34.5*27.5*23.5cm,10kg
Syringe packing 100g

50g and 500g packing jar

MOQ:30kg
Payment terms:
T/T,Western Union or Paypal, L/C could be discussed
Shipping:DHL, EMS,TNT.