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SAC305 high temperature solder paste
silver solder paste
SAC305 high temperature solder paste
BBIEN'S SAC305 silver solder paste is a synthetic poly-adduct designed to exceed requirements for reliable solder joints in SMT PC board assemblies.
Chemical compositions
 
 
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 Chemical composition (wt.%)
Sn Ag Sb Cu Bi Zn Fe Al Cd
Sn96.5-Ag3.0-.Cu0.5 Bal. 3.0+/-1 <0.010 0.5±0.1 <0.010 <0.003 <0.02 <0.002 <0.002









Physical Speciality
   

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(℃)
Melting Point
g/cm3
Spec. Gravity
MPa
Tensile Strength
Sn96.5-Ag3.0-Cu0.5 217-219 7.50 53.3
Powder size:
 
MESH SIZE MICRONS SIZE Particular type
-200+325 75-45μm 2
-325+500 45-25μm 3
-400+635 38-20μm 4
-500 25-15μm 5
-635 15-3μm 6/7

Feature of Sn96.5Ag3.0Cu0.5 solder paste:

1.Halogen-free per IPC definition.
   Capable of 01005 print and reflow, even in air reflow environment.

2.Can print down to 8 mil x 8 mil apertures.

3.Designed specifically for fine feature printing with T4 powder

4.Low QFN/BGA voiding.

5.Excellent solderability with halogen-free chemistry.

6.Optimized flux residues to mitigate head-in-pillow defects Capable of print speeds up to 6 in/sec (150mm/sec).

7.Low slump behavior minimizes defects.
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