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Sn50Pb50 Pb flux core tin lead solder wire
![main Pb solder wire](/u_file/product/15_08_06/350X350_6c6675359e.jpg)
Sn50Pb50 Pb flux core tin lead solder wire
Sn50Pb50RA water-soluble core wire is a very low halide(<1000ppm), water-soluble flux cored solder.the flux core type can be divided into 1.5%,2.0%.3.0% Its post-soldering residue is water-soluble and can be easily cleaned with DI water. Our water-soluble core wire is recommended for use in any hand soldering application where high flux activity is desired.
Datasheet for Sn50Pb50 core wire solder
Flux core contents
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Datasheet for Sn50Pb50 core wire solder
main content | Impurity content% | |||||||||||
Standard | Sn | Pb | Sb | Ag | Cu | Fe | Zn | Bi | Al | As | Ni | Cd |
50±2 | bal | ≤0.10% | ≤0.02% | 0.1% | ≤0.02% | ≤0.001% | ≤0.10% | ≤0.001% | ≤0.03% | ≤0.01% | <0.01% | |
Testing result | 51 | bal | 0.032 | 0.0002 | 0.0057 | 0.002 | 0.0015 | 0.006 | 0.0024 | 0.0021 | 0.0032 | 0.0001 |
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Feature:
. Fast welding speed, superb wettibility,terrific expandability.
The tin-lead wire added the activated core 2%,featuring fast melting speed, superb wettibility,terrific expandability.Thereby it can offer distinguished soldering performance.
.Wonderful electrical conductivity, no core breakage and no splash.
.High temperature anti-oxygen
.Satisfactory soldering joint and favorable fluidity.
Solder joints are filled, and firm. Both RA and RMA are made in complicance with IPC J-STD-006 and JIS Z3283 class AA standards. All these solder flux can be dissolved in solvent, featuring a little smoke and very few splatters.
.Flux content ranges from 1.5% to 3.5%, while the wire diameter can be opatinal avove 0.35mm(0.4mm,0.5mm,0.8mm,1.0mm…)
. Fast welding speed, superb wettibility,terrific expandability.
The tin-lead wire added the activated core 2%,featuring fast melting speed, superb wettibility,terrific expandability.Thereby it can offer distinguished soldering performance.
.Wonderful electrical conductivity, no core breakage and no splash.
.High temperature anti-oxygen
.Satisfactory soldering joint and favorable fluidity.
Solder joints are filled, and firm. Both RA and RMA are made in complicance with IPC J-STD-006 and JIS Z3283 class AA standards. All these solder flux can be dissolved in solvent, featuring a little smoke and very few splatters.
.Flux content ranges from 1.5% to 3.5%, while the wire diameter can be opatinal avove 0.35mm(0.4mm,0.5mm,0.8mm,1.0mm…)
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